JuncWay®Series seal ring special coating-semiconductor equipment localization key

Application Parts: All kinds of O-rings and sealing rings in semiconductor equipment.

face problems: The sealing ring is prone to adhesion, aging and chip falling in high temperature and plasma environment. At the same time, it is necessary to prevent the rubber from sticking to the metal flange and ensure extremely low metal ion precipitation (PPB grade).

Solution: According to different processes (such as JW-039/050 for etching, JW-059 for CMP), the corresponding coating thickness of 1-2 μm is selected.

application effect:

• anti-sticking and anti-friction: surface energy <22mN/m, friction coefficient of about 0.05, so that the rubber and metal bonding force from 300N to 50N, easy to disassemble.

• resistance to plasma and chemical corrosion: Through the plasma test of mixed gas containing fluorine and oxygen.

• ultra-high clean: metal ion precipitation rate <10 PPB, meet the requirements of the most advanced process.

• industry status: It has become the "only verified supplier" in this field in China, realizing the domestic substitution of key materials.